Nominal Granule Size[标称颗粒大小] | 4 |
Structure[结构] | Isotactic |
Weight[重量] | 100 g - 1000 g |
Electrical Properties(电气特性) |
Dielectric constant @1MHz | 2 - 3 |
Dielectric strength ( kV mm⁻1 ) | 30.0 - 40.0 |
Dissipation factor @ 1MHz | 0.0003 - 0.0005 |
Surface resistivity ( Ohm/sq ) | 1013 |
Volume resistivity ( Ohmcm ) | 101⁶-101⁸ |
Mechanical Properties(机械性能) |
Abrasive resistance - ASTM D1044 ( mg/1000 cycles ) | 13 - 16 |
Coefficient of friction | 0.10 - 0.30 |
Elongation at break ( % ) | 150.0 -300.0, for biax film >50 |
Hardness - Rockwell | R80-100 |
Izod impact strength ( J m⁻1 ) | 20.0 - - 100.0 |
Tensile modulus ( GPa ) | 0.90 - 1.50 , for biax film 2.2-4.2 |
Tensile strength ( MPa ) | 25.00 - 40.00 , for biax film 130-300, |
Chemical Resistance(耐化学性) |
Acids - concentrated | Good-Fair |
Acids - dilute | Good-Fair |
Alcohols | Good |
Alkalis | Good |
Aromatic hydrocarbons | Fair |
Greases and Oils | Good-Fair |
Halogenated Hydrocarbons | Good-Poor |
Halogens | Poor |
Ketones | Good |
Physical Properties(物理性质) |
Density ( g cm⁻3 ) | 0.900 |
Flammability | HB |
Limiting oxygen index ( % ) | 18 |
Radiation resistance | Fair |
Refractive index | 1.490 |
Resistance to Ultra-violet | Poor |
Water absorption - equilibrium ( % ) | 0.03 |
Thermal Properties(热性能) |
Coefficient of thermal expansion ( x10⁻⁶ K⁻1 ) | 100.000 - 180.000 |
Heat-deflection temperature - 0.45MPa ( C ) | 100 - 105 |
Heat-deflection temperature - 1.8MPa ( C ) | 60.0 - 65.0 |
Lower working temperature ( C ) | - -10 - -60 |
Specific heat ( J K⁻1 kg⁻1 ) | 1700.0 - 1900.0 |
Thermal conductivity ( W m⁻1 K⁻1 ) | 0.10 - 0.22 @23℃ |
Upper working temperature ( C ) | 90 - 120 |